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Report Highlights
The global market for semiconductor devices for high-temperature applications is estimated to increase from $11.8 billion in 2024 to reach $18.5 billion by 2029, at a compound annual growth rate (CAGR) of 9.4% from 2024 through 2029.
Report Includes
- 59 data tables and 54 additional tables
- An analysis of the global market for semiconductor devices for high-temperature applications
- Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029
- Evaluation of the market potential for semiconductor devices for high- temperature applications, industry growth drivers, and forecasts for this market’s segments and sub-segments
- Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region
- Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications
- Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications
- Discussion on the industry’s ESG challenges and practices
- Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages
- Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape
- Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.
Report Scope
This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.
Report Synopsis
| Report Metrics | Details | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Base year considered | 2023 | ||||||||||||||||||
| Forecast period considered | 2024-2029 | ||||||||||||||||||
| Base year market size | $10.9 billion | ||||||||||||||||||
| Market size forecast | $18.5 billion | ||||||||||||||||||
| Growth rate | CAGR of 9.4% for the forecast period of 2024-2029 | ||||||||||||||||||
| Units considered | $ Millions | ||||||||||||||||||
| Segments covered | Materials, Device Types, Operating Temperature, Industry | ||||||||||||||||||
| Regions covered | North America, Europe, Asia-Pacific, Rest of the World | ||||||||||||||||||
| Countries covered | U.S., Canada, Mexico, Italy, Germany, U.K., France, Spain, the Netherlands, China, Japan, South Korea, India, Australia, New Zealand, South America, Middle East and Africa | ||||||||||||||||||
| Key Market Drivers |
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| Companies studied |
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Report Highlights
The global market for semiconductor devices for high-temperature applications should grow from $3.9 billion in 2018 to $9.4 billion by 2023 with a compound annual growth rate (CAGR) of 19.2% for the period of 2018-2023.
Report Includes
- 69 data tables and 57 additional tables
- An overview of the global markets and applications of high temperature semiconductor devices
- Analyses of market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
- Explanation of drivers, restraints, key developments and future outlook of the high temperature semiconductor devices industry
- Description of Gallium Nitride (GaN), Silicon Carbide (SiC), and Gallium Arsenide (GaAs); their products and application
- Detailed profiles of the major players in the market, including Cree Inc., Infineon Technologies Ag, Allegro Microsystems Llc, Smart Modular Technologies (WWH) Inc., Genesic Semiconductor Inc., The Dow Chemical Co., and United Silicon Carbide Inc.
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